Electronics Manufacturing Services

bpro has PCB design service activity which is carried out by a team of highly experienced professionals dedicated to customer services and interaction.

Electronics Manufacturing Services (EMS)

bpro has PCB design service activity which is carried out by a team of highly experienced professionals dedicated to customer services and interaction. We also undertake customized PCB design for various Form factors with very high mechanical constraints.

Services

PCB Design

bpro labs is electronics devote ourselves to provide the best quality, quick delivery, engineering support, and best after-sales PCB service with cost effective solutions to our customers. Professional PCB prototype assembly with the guaranteed quality for PCB prototype, produce high-quality PCB’s with a competitive price.

Optimizing PCB layout design for manufacturability is one of the most crucial aspects of any product’s development process. Key decisions made during the design stage often have a tremendous impact on the cost and success of your product’s manufacturing and production.

bpro labs provides a wide range of PCB design services including schematic capture, BOM generation, PCB layout, & step file generation.
PCB Design Services

Layers

Professional PCB Design Services of all types, including, Single-Layer, Double-Layer and Multi-Layer up to 12 Layers.

Layouts

Highly Complex & Dense PCB layout designs done with speed & accuracy

Services

Advanced component footprints & library creation including BGA, QFN packages as per IPC standards

Reverse Engineering

Reverse engineering services to correct flaws or to optimize existing PCB designs

Upgrade

Upgrade old PCB’s with outdated & obsolete components to the latest technology with widely available SMT components

Testing

Electrical & Functional Testing services of the designed PCB

We have experience with various PCB CAD tools with our primary tool being PULSONIX.

ELECTRONICS ASSEMBLY & MANUFACTURING

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PCB Prototyping

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PCB Testing

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Wave Soldering

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SMT Soldering

Manufacturing Machine We Use

SMT S10 YAMAHA PICK AND PLACE MACHINE

Board size : (with buffer unused) Min. L 50 x W 30 mm to
Max. L 1,330 x W 510 mm
Board thickness: 0.4 – 4.8 mm
Placement speed : (12 heads + 2 theta)
Opt. Cond. : 0.08 sec/CHIP (45,000CPH)
Placement accuracy A (μ+3 ) : CHIP +/- 0.040 mm, IC +/- 0.025 mm
Placement angle: +/-180 degrees
Component height: Max. 30 mm *1

KONARK 145 RE FLOW OVEN

Maximum PCB Width : 300 mm
Heating Length : 1550 mm
Max Temperature : 300˚C
Maximum Conveyor Speed : 2 m/min / 200 CPM
Clearance above Mesh : 60 mm

EMST PLCTT Wave Soldering

Overall dimensions : L – 1730 mm, W – 880 mm, H – 825 mm
Weight : 200 kg. (441 lb) max weight, without solder alloy
Supply voltage : Standard – 415 V, 3 phase, 50 Hz
Power consumption : 5 kVA total max

SEMI AUTO SCREEN PRINTER

Pcb size : 400 mm x 250 mm
Printing table size : 500 mm x 300 mm
Stencil size : adj. Up to 22” x 22”
Squeeze speed : 0-100 mm/sec
Power : 220v/ 50hz,
Pneumatic : 3cfm @ 5-7kg/cm 2