Electronics Manufacturing Services
![robotics-18-1024x1024](https://bprolabs.com/wp-content/uploads/2023/03/robotics-18-1024x1024-1.png)
![EMS change](https://bprolabs.com/wp-content/uploads/2023/03/EMS-change.jpg)
Electronics Manufacturing Services (EMS)
bpro has PCB design service activity which is carried out by a team of highly experienced professionals dedicated to customer services and interaction. We also undertake customized PCB design for various Form factors with very high mechanical constraints.
![3d PCB](https://bprolabs.com/wp-content/uploads/2023/03/3d-PCB.png)
Services
PCB Design
Optimizing PCB layout design for manufacturability is one of the most crucial aspects of any product’s development process. Key decisions made during the design stage often have a tremendous impact on the cost and success of your product’s manufacturing and production.
Layers
Professional PCB Design Services of all types, including, Single-Layer, Double-Layer and Multi-Layer up to 12 Layers.
Layouts
Highly Complex & Dense PCB layout designs done with speed & accuracy
Services
Advanced component footprints & library creation including BGA, QFN packages as per IPC standards
Reverse Engineering
Reverse engineering services to correct flaws or to optimize existing PCB designs
Upgrade
Upgrade old PCB’s with outdated & obsolete components to the latest technology with widely available SMT components
Testing
Electrical & Functional Testing services of the designed PCB
We have experience with various PCB CAD tools with our primary tool being PULSONIX.
![Pulsonic](https://bprolabs.com/wp-content/uploads/2023/03/Pulsonic.png)
![robotics-Illustration_16](https://bprolabs.com/wp-content/uploads/2023/03/robotics-Illustration_16.png)
ELECTRONICS ASSEMBLY & MANUFACTURING
PCB Prototyping
PCB Testing
Wave Soldering
SMT Soldering
Manufacturing Machine We Use
SMT S10 YAMAHA PICK AND PLACE MACHINE
Board size : (with buffer unused) Min. L 50 x W 30 mm to
Max. L 1,330 x W 510 mm
Board thickness: 0.4 – 4.8 mm
Placement speed : (12 heads + 2 theta)
Opt. Cond. : 0.08 sec/CHIP (45,000CPH)
Placement accuracy A (μ+3 ) : CHIP +/- 0.040 mm, IC +/- 0.025 mm
Placement angle: +/-180 degrees
Component height: Max. 30 mm *1
KONARK 145 RE FLOW OVEN
Maximum PCB Width : 300 mm
Heating Length : 1550 mm
Max Temperature : 300˚C
Maximum Conveyor Speed : 2 m/min / 200 CPM
Clearance above Mesh : 60 mm
EMST PLCTT Wave Soldering
Overall dimensions : L – 1730 mm, W – 880 mm, H – 825 mm
Weight : 200 kg. (441 lb) max weight, without solder alloy
Supply voltage : Standard – 415 V, 3 phase, 50 Hz
Power consumption : 5 kVA total max
SEMI AUTO SCREEN PRINTER
Pcb size : 400 mm x 250 mm
Printing table size : 500 mm x 300 mm
Stencil size : adj. Up to 22” x 22”
Squeeze speed : 0-100 mm/sec
Power : 220v/ 50hz,
Pneumatic : 3cfm @ 5-7kg/cm 2